What products are suitable for the fully automatic dual slot Pcb cleaning and drying equipment and ultrasonic cleaning machine?

The fully automatic dual slot PCB cleaning and drying equipment (ultrasonic cleaning+drying) is designed specifically for electronic manufacturing, precision instruments, and other fields, suitable for workpieces that require efficient cleaning, residue free, and fast drying. The following are typical application scenarios and compatible products:

1. Core applicable products

(1) Printed Circuit Board (PCB) Class

Bare board/SMT PCB: Remove solder flux residue, solder paste, and dust (to avoid circuit short circuits).

High density board (HDI): Precision cleaning of contaminants inside micropores and blind holes (requires high-frequency ultrasound such as 40kHz).

Flexible Circuit Board (FPC): Deionization contamination, fingerprint (low-temperature cleaning to prevent deformation).

(2) Electronic components

SMT surface mount components: resistors, capacitors, BGA solder balls (oxide layer removed, flux).

Connectors/Connectors: USB interface, pin headers (remove oil stains from the plating surface).

Power module: IGBT, MOSFET heat dissipation substrate (to remove residual thermal grease).

(3) Semiconductor related

Wafer carrier/ceramic substrate: Remove particle contaminants (requires ultrapure water rinsing).

Lead frame: degreasing and cleaning before electroplating to improve coating adhesion.

2. Equipment advantages and adaptability

Double slot automation process:

First slot (ultrasonic cleaning): The frequency can be selected from 28kHz (heavy pollution) or 40kHz (precision), paired with water-based/solvent based cleaning agents.

Second tank (drying):

Hot air/vacuum drying to avoid water residue (especially suitable for high-precision PCBs).

Efficient production: suitable for assembly line operation, the entire cleaning and drying process takes 5-15 minutes (subject to process adjustment).

3. Expand applicable products

Optical components: camera module, fiber optic connector (clean and undamaged).

Medical electronics: Endoscope circuit module, sensors (cleaned before sterilization).

Automotive electronics: ECU control board, automotive radar PCB (with moisture-proof coating residue removed).

4. Products that are not applicable or require caution

Non moisture resistant components: such as unencapsulated humidity sensors.

Brittle materials: Unprotected ceramic components (may suffer from cavitation damage).

Assembly components with mechanical structures, such as motors (to prevent loss of bearing grease).

5. Key parameter suggestions

Cleaning agent selection:

Flux residue: neutral pH solvent (such as alcohol based).

Solder paste cleaning: low foaming water-based cleaning agent.

Temperature control:

Cleaning tank: 40-60 ℃ (balancing cleaning efficiency and material temperature resistance).

Drying tank: 60-80 ℃ (to avoid deformation of PCB substrate).

6. Industry application cases

Consumer electronics: Cleaning of mobile phone motherboards (to prevent oxidation of 5G antennas).

Industrial control: PLC module to remove industrial oil pollution.

Aerospace: Military grade cleaning of high reliability PCBs.